Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 615 items
Outstanding cooling effect!
Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.
Immediate delivery is possible for in-stock items! We have a range of standard products available from 20mm square to 1m long, suitable for various applications.
We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. As these are in stock, we can deliver them immediately, and we also sell peripheral equipment such as cooling water circulation devices. Additionally, we are open to inquiries for custom products. 【Features】 ■ Exceptional cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery available for in-stock items ■ Peripheral equipment such as cooling water circulation devices also for sale ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.
Made of oxygen-free copper with excellent thermal conductivity and durability! In addition to 8 types of standard products, we can also manufacture various custom products according to your needs.
In recent years, the demand for UV-LED has significantly expanded. We would like to introduce the "water-cooled heat sink" that maximizes its performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. In addition to eight standard types compatible with various manufacturers' LEDs, custom production is available up to approximately 500×800 millimeters. We also offer processing such as tapping, notching, surface treatment, and helicoil installation upon request. Please feel free to contact us. 【Features】 ■ Made of oxygen-free copper, excellent in thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to eight standard types, various custom products can be manufactured according to application ■ Socket types include pipe, bamboo shoot type, PT thread, and nut fastening ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.
Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments such as 1U rack-mounted servers that have blower fans installed or small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the operating environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.
Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.
Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To achieve cooling, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink made from a single piece of aluminum ingot (raw material state) that has been machined (skyve processed).
This is a series of stainless steel sinks made from stainless material processed through a special manufacturing process and pressed without heat treatment.
This product is made from SUS430 (18CR) stainless steel (stainless steel sheet material processed through a special manufacturing process) that has been pressed to a depth of 260mm without heat treatment.
This is a series of stainless steel sinks made from stainless material processed through a special manufacturing process and pressed without heat treatment.
This product is made from SUS430 (18CR) stainless steel (stainless steel sheet material processed through a special manufacturing process) and is pressed to a depth of 260mm without heat treatment.
We handle heat sinks from ATS Corporation in the United States as an authorized distributor. We accommodate custom requests for dimensions and shapes.
If you have custom requests, please fill out the attached sheet and contact us. By adopting a dedicated mounting clip, direct attachment to the BGA has become possible. This minimizes the mounting area and eliminates the need for hole processing on the PCB, making it ideal for increasing design flexibility. A new easy-to-install pin-fixed type has also been introduced! *Due to our contract with the manufacturer, we accept inquiries for annual usage of 1,000 units or more.
The issue with copper materials, which are widely used due to their thermal conductivity cost in various heat dissipation plates, heat sinks, and thermal compression terminal jigs, is performance degradation caused by the formation of oxide scale.
Various heat dissipation plates and heat sinks, as well as thermal compression terminal jigs, commonly use copper materials due to their thermal conductivity cost. The issue is the degradation of performance caused by the formation of oxidation scale, particularly in thermal problems that exceed 500°C, which cannot be addressed with aluminum. While copper is the next candidate due to its processability and price in terms of thermal conductivity, the oxidation scale that occurs at high temperatures poses problems for heat dissipation and contamination. We have now applied nickel plating to copper substrates and conducted our specialty treatment to prevent high-temperature oxidation scale with a transparent coating. This allows the thermal conductivity of copper to remain intact while making it usable at temperatures up to 900°C in air. We also offer coating treatment for the copper heat sinks you are currently using.
![[Case Study] Optimization of Heat Sink Shape](https://image.mono.ipros.com/public/product/image/946/2000439976/IPROS2368818307460003212.jpg?w=280&h=280)
Introducing a case study on the optimization of heat sink shapes, which is crucial for CPU heat dissipation measures!
We would like to introduce a case study on the shape optimization of heat sinks using our "modeFRONTIER." Optimizing the heat dissipation performance of heat sinks is crucial in addressing the heat generation issues of CPUs used in computers and other devices. With the multi-objective optimization of "modeFRONTIER," we can explicitly present a lineup of heat sinks with high heat dissipation performance, each suited to the diverse product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Heat management for CPUs used in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: Using multi-objective optimization, we explicitly present a lineup of heat sinks with high heat dissipation performance suitable for diverse product shapes as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.
WKBS Forced Air Cooling Dedicated Heat Sink
This is a dual-sided riveted type heat sink that applies the conventional single-sided riveting method (KBS) series. ● It is a high-performance heat sink specifically designed for forced air cooling, capable of both single-sided and dual-sided mounting. ● It features an optimal structural design for mounting various modules such as Tr, DI, and IGBT. ● Compared to conventional products, the upper and lower fins are fixed, eliminating the need for fin retaining plates, so no side mounting screws are required. ● It prevents fin vibration. ● Even in the single-sided mounting type, component mounting is possible on the backside.
A heat sink suitable for thin, lightweight, low-power CPUs. We can calculate the heat dissipation performance and propose specifications that meet your needs.
The "PB type" is a standard small and lightweight heat sink suitable for mounting on a circuit board. It has a well-balanced fin spacing and height, providing adequate heat dissipation performance for natural air cooling, making it suitable for installation on low-power CPUs under 10W. Designed for TO-220 and TO-3P type devices, it is equipped with 4.5mm pins that can be soldered to the circuit board. It can also be applied without the pins, installed parallel to the circuit board. We also offer specifications proposals using simple calculations and simulation software. 【Features】 ■ Thin and lightweight ■ Product length: 25mm (with exceptions such as 30mm depending on the model) ■ Surface treatment: Black anodized aluminum (cut surfaces and taps are not anodized) ■ Capable of proposing suitable specifications along with thermal design and custom processing *For more details, please refer to the materials. Feel free to contact us with any inquiries.
